flipchip

英语音标

英语翻译

n.倒装

adj.倒装

英语例句

The Flipchip bonded wafer is expected to increase from 3.4 million (2000) to 26.2 million (2005) wafers. 倒装焊晶片预计由三百四十万片(2000年)增长至二千六百二十万片(2005年)。

Pb is exempted if its composition is >85%. As for the flipchip bump, how do we measure this composition? 问:成分大于85%25的铅不在指令范围内．如果是倒装焊,我们应该怎样测量它的成分？

The Flipchip bonded wafer market is predicted to grow 37% annually while the overall IC units will only grow 8%. 倒装焊晶片市场预计年增长37%25，而整体IC增长仅8%25。